ANSYS eNews August2014

Change of Heart
A new heart valve replacement procedure modeled with multiphysics simulation could eliminate the need for open-heart surgery. Because there is no way to accurately measure forces on an implanted stent, manufacturers of transcatheter aortic valve replacement stents simulate the process of implanting a stent and valve to better understand the method and estimate the forces on the implanted stent. This is a very complex analysis problem.

Fast, Accurate Simulations for Fuel Combustion Applications
Merging the technical strengths of Reaction Design and ANSYS into a single company creates new opportunities to enable the development of less-polluting, higher-efficiency and more-competitive products in transportation, energy and materials processing sectors.

CFD Tech Tip: Simulating Mixing Tank and Bioreactor Performance
Due to the complexity of mixing tanks and bioreactors geometries, performing CFD analysis can be seen as complicated. ANSYS computational fluid dynamics offers a solution to this challenge: a fully automated solution where engineers input the mixing tank geometric parameters and operating conditions then the complete design analysis is performed automatically.

ANSYS
ANSYS Releases New Version of SCADE System

4moms Leverages ANSYS to Develop Innovative Products

ANSYS Appoints Robert Kocis as Vice President, Worldwide Sales and Support

ANSYS, Inc. Reports Record Q2 2014 Results

CXO Today:
Simulation is the Future of Innovation

Semiconductor Engineering:
FinFET Based Designs: Reliability Verification Implications

Raising the Abstraction of Power: Trends


August
18 – 22	The Bioprocessing Summit Boston, U.S.A

September
8 – 10	36th Annual International 2014 EOS/ESD Symposium Tucson, U.S.A.

14 – 18	IEEE Energy Conversion Congress & Expo (ECCE) Pittsburgh, U.S.A.

Webinars

Coupled Piezoelectric–Structural–Fluids Analysis
August 27 at 9:00 am EDT
September 3 at 1:30 am EDT
Simulation of piezoelectric devices is common practice in ANSYS Mechanical and ANSYS MAPDL, but it is less common to model the interaction of piezoelectric devices with the surrounding fluid medium. The damping provided by the fluid medium and the flow induced by piezoelectric displacements can be an important factor in designing piezoelectric devices. This webinar will demonstrate a multiphysics simulation using ANSYS Workbench to couple a piezoelectric solution in ANSYS Mechanical with a fluids solution in ANSYS Fluent.

Missed a webcast live? Go to the ANSYS Resource Library to view the recordings on demand.

Seminars
Every month ANSYS sponsors a wide range of seminars around the world. Watch for these Lunch and Learn and one-day events in your region.

How Is FinFET Technology Changing the Meaning of Chip Sign-Off?
Modern high-tech products using chips that are designed with the latest deep sub-micron process technologies (28nm and below) and FinFET technology offer higher performance, smaller footprint and lower power. However, power integrity analysis and reliability challenges become increasingly complex for chip package designs using these devices. Learn more.

Comprehensive Layout-Based On-Chip and Chip-Package-System ESD Sign-off Solution Tutorial
If you are attending the 2014 EOS/ESD Symposium in Tucson, U.S.A. consider registering for this informative tutorial session on September 11. And, don't miss ANSYS papers at the EOS/ESD Electronic Design Automation session on September 10.

Structural Tech Tip: Leveraging Parametric CAD Models with ANSYS Bidirectional Interfaces
Existing native CAD geometry can be used for simulation directly, without translation. In addition, ANSYS Workbench also imports additional attributes such as materials, selections of entities and more importantly the design parameters.

ANSYS Comprehensive Solutions for Advanced Materials
Complex systems require innovative use of materials. Composite systems simulation can be time consuming without dedicated solutions so ANSYS had developed an intuitive efficient process for simulating composite systems.

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