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July 2014

eNews
Features In the News Events Hot Topics

Features

 
Advancing Low-Power Mobile Electronics Advancing Low-Power Mobile Electronics
Devices that facilitate communication, provide entertainment, monitor our health and keep us safe are part of an infrastructure known as the Internet of Things, which is made possible by the mobile ecosystem. Chip-aware system simulation solutions help companies meet power, performance and price targets ensuring that the devices you depend on operate efficiently and reliably to keep you connected to family, friends and environment. View this video to learn more.
View Video

Latest Issue of ANSYS Advantage Latest Issue of ANSYS Advantage
Multiphysics simulation, once considered an advanced engineering strategy leveraged only by experts, is becoming a standard part of today’s product development toolkit in many industries. By using multiphysics studies to predict and verify product performance under a wide range of operating conditions engineering teams can eliminate many sources of real-world product failure. This issue's spotlight features articles from many companies who are employing multiphysics simulation to ensure product reliability and performance.
Full Story

Making the Leap to Campus-Wide Licensing
Monash Motorsport optimizes a Formula FSAE car.
Making the Leap to Campus-Wide Licensing
Every year, in classrooms and labs across the Australia and New Zealand, thousands of future engineers first encounter the power of simulation software. Channel partner LEAP Australia assist leading universities to create the ideal academic environment for broader adoption of engineering simulation — one in which software is scaled for easy, cost-effective application by a wide range of users, across multiple faculties, students and researchers.
 
Full Story

In the News

Features In the News Events Hot Topics  

ANSYS
U.S. Environmental Protection Agency Designs Test Engine with ANSYS Simulation Technology

Engineering.com:
The ANSYS Workbench and the Future of Simulation

 

Eureka:
ANSYS and SpaceClaim: A Greater Whole?

SemiWiki:
Intel & ANSYS Enable 14nm Chip Production

Events

Features In the News Events Hot Topics  
August
3 – 8 IEEE International Symposium on Electromagnetic Compatibility (EMC)
Raleigh, U.S.A.


Full Calendar
 

Webinars

All Webinars

Productivity Tips When Using ANSYS DesignModeler and ANSYS Mechanical
July 23 at 1:30 am EDT
July 30 at 4:00 pm EDT
Ease-of-use tools are available in the updated ANSYS DesignModeler and ANSYS Mechanical packages. In this web event, ANSYS will demonstrate the tools then a panel of experts from the ANSYS development and technical services groups will answer questions live via WebEx.

Missed a webcast live? Go to the ANSYS Resource Library to view the recordings on demand.

Seminars

All Seminars
Every month ANSYS sponsors a wide range of seminars around the world.
Watch for these Lunch and Learn and one-day events in your region.

Events

Features In the News Events Hot Topics  
ANSYS blog

Master’s Degree in Numerical Simulation in Engineering with ANSYS
In collaboration with ANSYS, the Technical University of Madrid (UPM) offers an online master’s degree to train experts in fluid mechanics and solid mechanics numerical simulation using ANSYS engineering tools. The master’s degree learning methodology is entirely online and taught in English and includes documentation, exercises, tutorials, online evaluation, tutor sessions, forum and exams via a virtual classroom.

 

ANSYS Resource Library

Technical Brief: Parallel Processing Improvements for Full-Wave Electromagnetic Solvers

Technical Brief: ANSYS SIwave: Port Radius and Port Impedance Impact on Accuracy

Technical Brief: Package and Board Power Integrity Design with ANSYS SIwave-PI

White Paper: SGI Technology Guide for ANSYS Mechanical Analysts

White Paper: SGI Technology Guide for ANSYS Fluent Analysts

 

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