ANSYS eNews September 2014

Getting Around in Style
The use of composites is rapidly growing across many industries, fostering the need for new design, analysis and optimization technologies. At KTM Technologies fiber-composites engineering, technology and consulting comprise the core business. The company uses advanced materials simulation to design many products quickly including a light-weight production sports car and a new concept electric bicycle.

Showcase Your Simulation Expertise in the ANSYS Hall of Fame
The sixth annual competition is open. Entries from around the world feature striking images and animations of real-world applications of ANSYS software. Enter for a chance to receive an Apple iPad. Deadline is November 17 so get started now!

Software Tech Briefs
The 2014 issue of Software Tech Briefs contains articles from companies applying ANSYS software to a wide range of challenges. This special supplement to NASA Tech Briefs sponsored by ANSYS also includes an overview of emerging trends in engineering simulation.

ANSYS
ANSYS Prepares UConn Engineering Students for Success in the Workplace

Training the Next Generation of Engineers with ANSYS

ANSYS Listed on Software 500 for Eighth Consecutive Year

Engineering and Technology Magazine:
Modeling & Simulation Lifts Aerospace Control Systems

Inside HPC:
Six Myths of HPC for Engineering Simulation

Silicon India:
A Virtual Door to the Real World

Biotech Wired:
ANSYS: Computing Just Got Cheaper, Rise of 64-Bit ARM Processors Tailwind to HPC

Biopharma Reporter:
Expert: Use Fluid Dynamics to Navigate Murky Waters During Scale-up


September
22 – 26	28th International Symposium on Ballistics Atlanta, U.S.A.

22 – 25	43rd Turbomachinery 30th Pump Symposia Houston, U.S.A.

October
26 – 29	IEEE Electrical Performance of Electronic Packaging & Systems (EPEPS) Portland, U.S.A.

Webinars

Achieve Faster IC Power Closure Using Streamlined Chip–Package Co-Analysis
September 23 at 9:00 am EDT
September 25 at 4:00 pm EDT
As system-on-a-chips (SoCs) grow in density and complexity, the variations in switching current and parasitic profiles increase. Power integrity engineers must focus on local details to ensure accurate power delivery requiring granular resolution of C4 bump-level connections between the SoC and the package. RedHawk-CPA provides a comprehensive power-analysis solution using chip and package layouts that allow for "what-if" analysis so you can view the impact to the overall power delivery when changes are made to the layout.

Missed a webcast live? Go to the ANSYS Resource Library to view the recordings on demand.

Seminars
Every month ANSYS sponsors a wide range of seminars around the world. Watch for these Lunch and Learn and one-day events in your region.

System-level Approach to Robust ESD Design
The battle is on for manufacturers of automotive, medical, industrial and consumer electronics to drive new innovations, deliver exciting products, and ensure safety and reliability of the devices that proliferate our world. Mobile devices that are intended to interact with our world face unique reliability challenges such as electrostatic discharge (ESD) protection, making a robust ESD design a necessity.
Learn more in this blog.

Best-Practice Enterprise Cloud for Engineering Simulation at ISC Cloud
Join ANSYS and other leaders in Cloud and HPC at the ISC Cloud Conference September 29 to 30 in Heidelberg, Germany. Wim Slagter of ANSYS will be presenting on Best-Practice Enterprise Cloud for Engineering Simulation at the event.

Industry Perspectives on Extreme Scalability for High-Fidelity CFD Simulations Webinar
Learn how the combination of Cray’s supercomputing solutions and ANSYS software address the simulation challenges faced by organizations attempting to achieve the highest level of fidelity in their simulation workloads. Join us for this web event October 14 or 16 with our special guest, Brian Mitchell, senior principal engineer at GE Global Research who will provide his perspective on extreme scalability

Resource Library
Case Study: Simulation-driven Product Development Speeds Design of Heat Exchangers from Two Weeks to Two Days

Presentation: Improve Pump Diaphragm Reliability Using ANSYS Nonlinear FEA

Presentation: Interferometric Antenna Array for Cell Phones, Helmets and Wearable Devices

Presentation: Hydrodynamic Analysis of the Dehydration Process in an Electrostatic Vessel

White Paper: Chip-Package Co-analysis Using ANSYS RedHawk-CPA

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