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September 2013

eNews
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Features

 
Sound Success Powered by Innovation
Known for game-changing product innovations, Pratt & Whitney has relied on engineering simulation to fuel its design process for over 35 years. Al Brockett, former vice president of engineering module centers, discusses the role of robust design in delivering revolutionary new products with a high degree of confidence.
Full Story

2013 ANSYS Convergence Webinar Series 2013 ANSYS Convergence Webinar Series
Join ANSYS and industry leaders for an informative webinar series featuring selected presentations from the ANSYS’ 2013 Convergence conferences worldwide. The series includes sessions highlighting trends and unique simulation solutions/methodologies as used by industry leaders.
 
Register

Formula for Racing Success Formula for Racing Success
Since 2007, students of the University of Applied Sciences Coburg (UAS Coburg) have participated in the Formula Student Germany competition. The team from UAS Coburg improved their car’s air intake system using ANSYS CFD within the parametric ANSYS Workbench environment.

Full Story

In the News

Features In the News Events Hot Topics  

ANSYS
ANSYS and GosNIIAS Partner to Increase Safety in Russian Aerospace Industry

Emirates Team New Zealand Sails Away With Louis Vuitton Cup Thanks to ANSYS Solutions

Desktop Engineering:
The Innovation Advantage

 

Manufacturing Engineering:
Simulations Speed Product Designs, Cut Manufacturing Costs

Huff Post:
Many Have Created Hyperloop Designs, But No One Will Fund

Medical Design Briefs:
Computer-Aided Diagnosis and Cardiac Surgery

Events

Features In the News Events Hot Topics  
 
September
30 – October 3 42nd Annual Turbomachinery Symposium
Houston, U.S.A.
Full Calendar
October
8 – 10 Enova Paris, RF & Hyper 2013
Paris, France
16 – 17 ANSYS Convergence Conference
Madrid, Spain
     

Webinars

All Webinars

Robust Electrical and Electronics Systems Design
LSI uses coupled multiple physics simulation to analyze and optimize IC system-level power noise. The methodology employed encompasses die, package and PCB interconnects, exposing the impact of the capacitive and mutual coupling enabled outside the silicon on the PLL supply. This allows selection of the best package routing solution for PLL supply noise reduction.

Missed a webcast? Go to the ANSYS Resource Library to view the recordings on demand.

Power, Noise and Reliability Webinar Series from Apache
This webinar series from ANSYS subsidiary Apache provides you with an opportunity to learn more about power management and power closure — primary concerns for system-on-chip designs. Join both customers and Apache experts at upcoming live web events or view past events on demand.

Conferences

 

Automotive Simulation World Congress
October 29 – 30
Frankfurt, Germany

Automotive Simulation World Congress Register

The preliminary agenda for the Automotive Simulation World Congress is now available. Keynote speakers include Peter Pirro, Manager Global Mid Tractor Product Verification and Validation at John Deere, Christoph Schött, Vice President Engineering Simulation at MAN Bus and Truck AG, and Al Peasland, Head of Technical Partnerships for Infinity Red Bull Racing.


User Group Conference SCADE

October 17 – 18
Paris, France

SCADE User Group Conference Register
This event provides attendees with an excellent forum to discuss and exchange views on their experiences with Esterel SCADE Solutions and get a full update on the latest Esterel SCADE technology.

Seminars

All Seminars
Every month ANSYS sponsors a wide range of seminars around the world.

Events

Features In the News Events Hot Topics  
ANSYS blog

High-speed Trains: Riding the Rails at 200 mph
How do the systems used within the rail infrastructure ensure passenger safety? Complex software systems in the train control center and on-board the train control speed, avoiding other trains and ensuring the train travels as expected.

Low-Power Design Webinar - What I Learned
A recent design for power methodology webinar explained how you can only design and optimize for low-power SoC designs if you can actually simulate the entire chip, package and system together.

TSMC Open Innovation Platform Ecosystem Forum
Norman Chang of ANSYS subsidiary Apache Design will present a paper on Advanced Power, Signal and Reliability Verification for 20nm, 16nm FinFET, and 3D-IC Designs at this conference being held in San Jose, U.S.A. on October 1.

 

SAE 2013 AeroTech Congress
Visit ANSYS subsidiary Esterel Technologies September 24 to 26 at booth 217 in Montreal, Canada to learn about critical systems and software development solutions. And, attend sessions where papers will be presented, including A Multi-disciplinary and Multi-scale Simulation-Based Approach for the Design of Control Systems co-authored by ANSYS and Esterel.

ANSYS Resource Library

Video: Aerospace Industry Demands Accurate, Fast and Reliable Simulation Technology

White Paper: An Open Solution for Systems and Embedded Software Simulation

Demo: Optimize Decoupling of PCB Using ANSYS SIwave PI Advisor

Demo: Transmission Line Analysis

Webinar on Demand: Using Coupled-Field Elements in ANSYS Mechanical and MAPDL R14.5

Webinar on Demand: Power Noise Reliability Sign-off for Custom and Analog IPs with SoC Integration

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