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September 2012

Features In the News Events Hot Topics


Wearing a Wire Wearing a Wire
Interest in body-worn wireless devices has grown in recent years because of actual and potential applications in healthcare, sports, law enforcement, entertainment and other areas. Using a wireless device in close proximity to the human body creates a number of design challenges. Simulation is helping to optimize these body-worn wireless devices.

Full Story

ASWC Keynote Speakers for the Automotive Simulation World Congress
Wayne Eckerle, Vice President, Research and Technology at Cummins, Inc. will deliver the featured keynote at the 2012 Automotive Simulation World Congress (October 30 and 31 in Detroit, Michigan, U.S.A.). Additional keynote addresses will be presented by Sin Min Yap, Vice President, Industry Strategy at ANSYS, Dipankar Choudhury, Vice President of Research at ANSYS, and David Coutts, Chief Technology Officer at IBM.

View the full agenda and register today!


Floating on Air Floating on Air
In a sport in which every fraction of a second counts, the Chrono Evo II and Pista Evo II are Avanti Bikes’ fastest racing machines ever. Frames for the time trial/triathlon and track racing bikes were developed with fluid dynamics software from ANSYS by optimizing aerodynamic performance of the individual parts and then the entire system.

Full Story

In the News

Features In the News Events Hot Topics  

ANSYS Launches Student Version of Robust Simulation Technology in U.S.

MicroWaves & RF
Ceramic Substrate Shrinks Patch Antenna


Desktop Engineering
CFD Making Waves in Olympic Swimming (Again)
When Two Plus Two Makes More Than Four



Features In the News Events Hot Topics  
23 – 25 ISPE Thermoforming 2012 Conference
Grand Rapids, U.S.A.
24 – 26 SAE 2012 Brake Colloquium & Exhibition
San Diego, U.S.A.
24 – 27 9th Military Antennas Summit
Washington, U.S.A.
24 – 27 41st Turbomachinery Symposium & the 28th International Pump Users Symposium
Houston, U.S.A.

Full Calendar
2 – 3 PLM Road Map 2012
Plymouth, U.S.A.
8 – 10 SPE Annual Technical Conference & Exhibition
San Antonio, U.S.A.
15 – 16 2012 IEEE Compound Semiconductor IC Symposium
La Jolla, U.S.A.
16 TSMC Open Innovation Platform Ecosystem Forum
San Jose, U.S.A.


All Webinars
Reducing Turnaround Time for In-Cylinder CFD Model Preparation
September 25 or September 27
Creating a model for CFD simulation can be challenging because components that move relative to each other, like pistons and valves, require moving and deforming meshes. This webinar will focus on demonstrating the ANSYS Workbench-based analysis system for in-cylinder simulation that reduces setup turnaround time. This web event is part of the series Recent Advances in Automotive Simulation.

Other ongoing webinar series include:

•   IT Solutions for ANSYS

Most webinars will be available on demand shortly after the final presentation.


2013 ANSYS Regional Conferences: Call for Presentations Submit Abstract
This convergence of computer-aided engineering experts and other thought leaders offers you the opportunity to exchange ideas and improve your engineering simulation skills. Submit your abstract to present at the regional conference near you.


All Seminars
Every month ANSYS sponsors a wide range of seminars around the world.
Dimensions of Electronic Design Seminar Series Register
The challenges of electronics design are numerous and include packing greater functionality into smaller portable devices while extending battery life, integrating multiple antennas into a single platform and developing 3D-IC architectures. Join ANSYS and Apache at one of our U.S. seminars as we introduce our latest electronics design technology and simulation breakthroughs that will help you to design the next generation electronics products.


Features In the News Events Hot Topics  

ANSYS blog

ANSYS.com Changes Announced
The ANSYS website has been given a facelift to make it easier for visitors to find important information. Find out more.

New HPC Capabilities for Electromagnetic Simulation
In electronics design, the time required to simulate models can become a significant bottleneck. ANSYS has addressed this challenge by substantially improving the high-performance computing (HPC) capabilities of ANSYS HFSS, the industry-standard simulation tool for 3-D full-wave electromagnetic field simulation. Download this white paper.

Chip-Aware System Design
September 26, 2:00 p.m. ET
Join us for this EE Times webinar on co-simulation methodologies for time and frequency domain simulations. This webcast will provide engineers with methods to successfully design power delivery networks with the chip to ensure system metrics are met in the context of an entire system.


NASA Tech Briefs Webinar: Scale-Resolving Turbulence Approaches to Industrial CFD
October 17, 1:00 p.m. ET
In this webinar, the state of scale-resolving simulation (SRS) techniques for turbulent flow predictions in ANSYS CFD will be reviewed with emphasis on turbulence models that are already in use in industrial simulations, including traditional large eddy simulation models, hybrid LES-RANS methods and innovating scale-adaptive approaches. Appropriate application areas for each model group will be discussed.

ANSYS Resource Library

Hall-Effect Sensors

Technical Brief: Hall-Effect Sensors

Technical Brief: ANSYS HFSS for ECAD with Cadence

Video: Champions by Design with Speedo

Webinar on Demand: Model Order Reduction — Icepak–Simplorer Coupling and Beyond

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